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data sheet november 29, 2011 ESTW010A0A series (eighth - brick) dc - dc converter power modules 36 C 75vdc input; 5.0vdc output; 10a output current * ul is a registered trademark of underwriters laboratories, inc. ? csa is a registered trademark of canadian standards association. ? vde is a trademark of verband deutscher elektrotechniker e.v. this product is intended for integration into end - user equipment . all of the required procedures of end - use equipment should be followed. ieee and 802 are registered trademarks of the institute of electrical and electronics engineers, incorporated. * * iso is a registered trademark of the international organization of standards document no: ds11 - 0 06 ver. 1.0 1 pdf name: estw010a .pdf stingray ? series features ? w ide input voltage range: 36 - 75 v dc ? monotonic startup into prebiased load ? output voltage adjust: 80 % to 110% of v o,nom ? remote sense ? constant switching frequency ? positive remote on/off logic ? input under/over voltage protection ? output overcurrent and overvoltage protection ? over - temperature protection ? industry standard, dosa compliant footprint 57.9mm x 22.8mm x 8.5mm (2.28 in x 0.9 in x 0.335 in) ? low profile height an d reduced component skyline ? suitable for cold wall cooling using suitable gap pad applied directly to top side of module ? h igh efficiency : 9 1 % ? no thermal derating up to 80 c, 1.0m/s (200 lfm) ? wide operating temperature range ( - 40c to 85c) ? compliant to rohs eu directive 2002/95/ec ( - z versions) ? compliant to rohs eu directive 2002/95/ec with lead solder exemption (non - z versions) ? ul * 60950 - 1, 2 nd ed. recognized, csa ? c22. 2 no. 60950 - 1 - 07 certified, and vde ? (en60950 - 1, 2 nd ed.) licensed ? ce mark meets 2006/95/ec directive ? meets the voltage and current requirements for etsi 300 - 132 - 2 and complies with and licensed for basic insulation rating per en60950 - 1 ? 2250 vdc isolation tested in compliance with ieee 802.3 poe standards ? iso ** 9001 and iso 14001 certified manufacturing facilities applications ? distributed p ower a rchitectures ? wireless n etworks ? access and o ptical n etwork equipment ? industrial equipment options ? negative remote on/off logic (prefer red) ? over current/over temperature/over voltage protections (auto - restart) (preferred) ? heat plate version ( - h) ? surface mount version ( - s) ? rohs 6/6 compliant; lead free ( - z) ? for additional options, see table 2 (device options) under ordering information section. description the e stw0 10a0a , eighth - brick low - height power module is an isolated dc - dc converters that can deliver up to 10 a of output current and provide a precisely regulated output voltage of 5 .0v over a wide range of input voltages (v in = 36 - 75vdc). the modules achieve typical full load efficiency of 9 1 %. the open frame modules construction, available in both surface - mount and through - hole packaging, enabl e designers to develop cost and space efficient solut ions. rohs compliant
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 2 absolute maximum ratings stresses in excess of the absolute maximum ratings can cause permanent damage to the device. these are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. parameter device symbol min max unit input voltage continuous all v in - 0.3 80 v dc transient , operational ( 100 ms) all v in,trans - 0.3 100 v dc operating ambient temperature all t a - 40 85 c (see thermal considerations section) storage temperature all t stg - 55 125 c i/o isolation voltage (100% factory hi - pot tested) all 225 0 v dc electrical specifications unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. parameter device symbol min typ max unit operating input voltage all v in 36 48 75 v dc maximum input current all i in,max 2.0 a dc (v in = v in, min to v in, max , i o =i o, max ) input no load current all i in,no load 3 0 ma (v in = 48v , i o = 0, module enabled) input stand - by current all i in,stand - by 5 8 ma (v in = 48v , module disabled) inrush transient all i 2 t 0.5 a 2 s input reflected ripple current, peak - to - peak (5hz to 20mhz, 1h source impedance; v in, min to v in, max, i o = i omax ; see test configuration section) all 3 0 ma p - p input ripple rejection (120hz) all 50 db caution: this power module is not internally fused. an input line fuse must always be used. this power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. to preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. the safe ty agencies require a fast - acting fuse with a maximum rating of 5 a (see safety considerations section). based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. refer to the fuse manufacturers data sheet for further information.
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 3 electrical specifications (continued) parameter device symbol min typ max unit nominal output voltage set - point v in = 48v i o =i o, max , t a =25c) all v o, set 4.925 5 .0 5.075 v dc output voltage all v o 4.90 5.10 v dc (over all operating input voltage, resistive load, and temperature conditions until end of life) output regulation line (v in =v in, min to v in, max ) all 0.2 % v o, set load (i o =i o, min to i o, max ) all 0.2 % v o, set temperature (t ref =t a, min to t a, max ) all 1.0 % v o, set output ripple and noise ( co=1uf,ceramic+10uf,tantalum, v in =v in, min to v in, max , i o = i o, max , t a =t a, min to t a, max ) rms (5hz to 20mhz bandwidth) all 25 5 0 mv rms peak - to - peak (5hz to 20mhz bandwidth) all 75 2 00 mv pk - pk external capacitance 1 all c o 0 2,000 f output current all i o 0 10 a dc output current limit inception (hiccup mode ) all i o, lim 105 120 130 % i o (v o = 90% of v o, set ) output short - circuit current all i o, s/c 1.2 a rms (v o 250mv) ( hiccup mode ) efficiency v in = 48v , t a =25c, i o =i o, max , v o = v o,set all 91.0 % switching frequency all f sw 350 khz dynamic load response (co=1uf,ceramic+10uf,tantalum, di o /dt=0.1a/ s; v in = 48v ; t a =25c ) load change from io= 50% to 75% or 25% to 50% of i o,max peak deviation all v pk 25 0 mv settling time (vo<10% peak deviation) all t s 200 s 1. see note 2 under feature specifications. isolation specifications parameter device symbol min typ max unit isolation capacitance all c iso 1 000 pf isolation resistance all r iso 10 m i/o isolation voltage (100% factory hi - pot tested) all all 2 25 0 v dc general specifications parameter device symbo l min typ max unit calculated reliability based upon telcordia sr - 332 issue 2: method i case 3 (i o =80%i o, max , t a =40c, airflow = 200 lfm, 90% confidence) all fit 242.1 10 9 /hours all mtbf 4,130,475 hours weight (open frame) all 17 (0.60) g (oz.) weight (with heatplate) all 30 (1.06) g (oz.)
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 4 feature specifications unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. see feature descriptions for additional information. parameter device symbol min typ max unit remote on/off signal interface (v in =v in, min to v in, max ; open collector or equivalent, signal referenced to v in - terminal) negative logic: device code suffix 1 logic low = module on, logic high = module off positive logic: no device code suffix required logic low = module off, logic high = module on logic low - remote on/off current all i on/off 0.15 ma logic low - on/off voltage all v on/off - 0.7 0.6 v dc logic high voltage C (typ = open collector) all v on/off 2.4 15 v dc logic high maximum allowable leakage current all i on/off 25 a turn - on delay 1 and rise times (i o =i o, max , v in =v in, nom, t a = 25 o c) case 1: input power is applied for at least 1 second and then the on/off input is set from off to on (t delay = from instant at which on/off signal is on until v o = 10% of v o, set ). all t delay D 20 D msec case 2: on/off input is set to logic low (module on) and then input power is applied (t delay from instant at which v in = v in, min until v o =10% of v o,set ) all t delay D D 1 50 msec output voltage rise time (time for v o to rise from 10% of v o,set to 90% of v o, set ) all t rise D 1 5 D msec output voltage overshoot C startup all D 3 % v o, set i o = i o, max ; v in =v in, min to v in, max , t a = 25 o c prebias output load performance: all monotonic output start up characteristic back bias current drawn from output (module en abled) all - 150 ma dc remote sense range all v sense 10 % v o, set output voltage adjustment range all 8 0 110 % v o, set output overvoltage protection (co,min=220 f) 2 all v o, limit 6.0 7.0 v dc overtemperature protection C hiccup auto restart all t ref 13 5 o c input undervoltage lockout all v uvlo turn - on threshold 32 34.5 v dc turn - off threshold 27.5 30 v dc hysteresis 1 2 v dc 1. the module has an adaptable extended turn - on delay interval, t delay , of 2 0 ms. the extended t delay will occur when the module restarts following either: 1) the rapid cycling of vin from normal levels to less than the input undervoltage lockout (which causes mo dule shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. the normal turn - on delay interval, t delay , will occur whenever a module restarts with input voltage removed from the module for the preceding 1 secon d. 2. the module requires a minimum of 220 f external output capacitor to prevent shutdown during no load to full load transients and to avoid exceeding the ovp maximum limits during startup into open loop fault conditions.
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 5 characteristic curves the following figures provide typical characteristics for the module at 25 o c. the figures are identical for either positive or negative remote on/off logic. efficiency, (%) output current output voltage io(a) ( 2 a/div) v o (v) ( 2 00mv/div) output current, i o (a) time, t ( 2 00 s/div) figure 1 . converter efficiency versus output current. figure 4 . transient response to 0.1 a/ s dynamic load change from 50% to 75% to 50% of full load , vin=48v . output voltage v o (v) ( 2 0mv/div) on/off voltage output voltage v on/off (v) ( 2 v/div) v o (v) ( 2 v/div) time, t ( 2 s/div) time, t ( 20 ms/div) figure 2 . typical output ripple and noise ( v in =48v, i o = i o,max ). figure 5 . typical start - up using remote on/off, negative logic version shown (v in = 48v , i o = i o,max ). output current output voltage io(a) ( 2 a/div) v o (v) ( 2 00mv/div) in put voltage out put voltage v in (v) ( 5 0 v/div) v o (v) (2v/div) time, t ( 200 s/div) time, t ( 20 ms/div) figure 3 . transient response to 0.1a/ s dynamic load change from 25 % to 50 % to 25 % of full load , vin=48v . figure 6 . typical start - up using input voltage (v in = 48 v, i o = i o,max ).
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 6 test configurations figure 7 . input reflected ripple current test setup. figure 8 . output ripple and noise test setup. figure 9 . output voltage and efficiency test setup. design considerations input filtering the power module should be connected to a low ac - impedance source. highly inductive source impedance can affect the stability of the power module. for the test configu ration in figure 7 a 33 - 100 f electrolytic capacitor (esr<0. 7 at 100khz), mounted close to the power module helps ensure the stability of the unit. consult the factory for further application guidelines. safety considerations for safety - agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end - u se safety agency standard, i.e. ul60950 - 1, csa c22.2 no.60950 - 1, and vde0805 - 1(iec60950 - 1) . if the inpu t source is non - selv (elv or a hazardous voltage greater than 60 v dc and less than or equal to 75v dc ), for the modules output to be considered as meeting the requirements for safety extra - low voltage (selv), all of the following must be true: ? the input so urce is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. ? one v in pin and one v out pin are to be grounded, or both the input and output pins are to be kept floating. ? the input pins of the module are not op erator accessible. ? another selv reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the modules o utput. note: do not ground either of the input pins of the module without grounding one of the output pins. this may allow a non - selv voltage to appear between the output pins and ground. the power module has extra - low voltage (elv) outputs when all inputs are elv. all flammable materials used in the manufacturing of these modules are rated 94v - 0, or tested to the ul60950 a.2 for reduced thickness. for input voltages exceeding 60 v dc but less than or equal to 75 v dc , these converters have been evaluated to the applicable requirements of basic insulation between secondary dc mains distribution input (classified as tnv - 2 in europe) and unearthed selv outputs. the input to these units is to be provided with a maximum 5 a fast - acting fuse in the ungrounded lead. to oscilloscope current probe l test 12h battery c s 220f e.s.r.<0.1 @ 20c 100khz 33 - 100f vin+ vin - note: measure input reflected ripple current with a simulated source inductance (l test ) of 12h. capacitor c s offsets possible battery impedance. measure current as shown above. note: all voltage measurements to be taken at the module terminals, as shown above. if sockets are used then kelvin connections are requir ed at the module terminals to avoid measurement errors due to socket contact resistance. v o (+) v o ( C ) resistive load scope copper strip ground plane 10uf 1uf vout+ vout - vin+ vin - r load r contact r distribution r contact r distribution r contact r contact r distribution r distribution v in v o note: all voltage measurements to be taken at the module terminal s, as shown above. if sockets are used then kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. = v o . i o v in . i in x 100 % efficiency
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 7 feature description remote on/off two remote on/off options are available. positive logic turns the module on during a logic high voltage on the on/off pin, and off during a logic low. negative logic remote on/off, device code suffix 1, turns the module off during a logic high and on during a logic low. figure 1 0 . remote on/off implementation. to turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (v on/off ) between the on/off terminal and the v in ( - ) terminal (see figure 1 0 ). logic low is 0v v on/off 0.6 v. the maximum i on/off during a logic low is 0. 1 5 ma; the switch should maintain a logic low level whilst sinking this current. during a logic high, the ty pical maximum v on/off generated by the module is 1 5v , and the maximum allowable leakage current at v on/off = 2.4 v is 25 a. if not using the remote on/off feature: for positive logic, leave the on/off pin open. for negative logic, short the on/off pin to v in ( - ). remote sense remote sense minimizes the effects of distribution losses by regulating the voltage at the remote - sense connections (see figure 1 1 ). the voltage between the remote - sense pins and the output terminals must not exceed the out put voltage sense range given in the feature specifica tions table: [v o (+) C v o ( C )] C [sense(+) C sense( C )] 0.5 v although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of bot h. the maximum increase is the larger of either the remote sense or the trim. the amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. when using remote sense and trim, the output volt age of the module can be increased, which at the same output current would increase the power output of the module. care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = vo,set x io,max). figure 1 1 . circuit configuration for remote sense . input undervoltage lockout at input voltages below the input undervoltage lockout limit, the module operation is disabled. the module will only begin to operate once the input voltage is raised above the undervoltage lockout turn - on threshold, v uv/on . once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn - off threshold, v uv/off . overtemperature protection to provide prote ction under certain fault temperature conditions, the unit is equipped with a thermal shutdown circuit. the unit will shutdown if any of the thermal reference point s identified in figure s 1 3 & 14 , exceed the stated trip points (typical) . how ever, the thermal shutdown is not intended as a guarantee that the u nit will survive temperatures beyond its rating. the module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. if the auto - restart option (4) is ordered, the module will automatically restart upon cool - down to a safe temperature. output overvoltage protection the output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. this protection feature latches in the event of over voltage across the output. cycling the on/off pin or input voltage resets the latching protection feature. if the auto - restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. overc urrent protection to provide protection in a fault (output overload) condition, the unit is equipped with internal current - limiting circuitry and can endure current limiting continuously. at the point of current - limit inception, the unit enters hiccup mode. if the unit is not configured with auto C restart, then it will latch off following the over current condition. the module can be restarted by cycling the dc input power for at least one second or by toggling the remo te on/off signal for at least one second. on/off vin+ vin - i on/off v on/off vout+ trim vout - v o (+) sense(+) sense( C ) v o ( C ) v i (+) v i (-) i o lo ad c ont ac t an d d istribution losses suppl y i i cont ac t r esist a nce
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 8 feature description (continued) if the unit is configured with the auto - restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output curre nt is brought back into its specified range. the average output current during hiccup is 10% i o, max . output voltage programming trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resis tor between the trim pin and either the v o (+) pin or the v o ( - ) pin . figure 1 2 . circuit configuration to trim output voltage. connecting an external resistor (r trim - down ) between the trim pin and the v o ( - ) (or sense( - )) pin decreases the output voltage set point. to maintain set point accuracy, the trim resistor tolerance should be 1.0%. the following equation determines the required external resistor value to obtain a percentage output voltage change of % where for example, to trim - down the output voltage of the module by 8% to 11.04 v, rtrim - down is calculated as follows: connecting an external resistor (r trim - up ) between the trim pin and the v o (+) (or sense (+)) pin increases the output voltage set point. the following equation determine s the required external resistor value to obtain a percentage output voltage change of %: where for example, to tri m - up the output vol tage of the module by 5% to 12.6 v, r trim - up is calculated is as follows: the voltage between the v o (+) and v o ( C ) terminals must not exceed the minimum output overvoltage protection value shown in the feature specifications table. this limit includes any increase in voltage due to remote - sense compensation and output voltage set - point adjustment trim. although the out put voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. the maximum increase is the larger of either the remote sense or the trim. t he amount of power delivered by the modul e is defined as the voltage at the output terminals multiplied by the output current. when using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = v o ,set x i o ,max ). v o (+) v o trim v o ( - ) r trim - down load v in (+) on/off v in ( - ) r trim - up 22 . 10 % 511 down trim r 100 % , , set o desired set o v v v 8 % 22 . 10 8 511 down trim r 655 . 53 down trim r 22 . 10 % 511 % 225 . 1 %) 100 ( 11 . 5 , set o up trim v r 100 % , , set o set o desired v v v 5 % 22 . 10 5 511 5 225 . 1 ) 5 100 ( 0 . 12 11 . 5 up trim r 8 . 938 up trim r
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 9 thermal considerations the power modules operate in a variety of thermal environments ; however, sufficient cooling should be provided to help ensure reliable operation. considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. a reduction in the operating temperature of the module will result in an increase in reliability. the thermal data presented here is bas ed on physical measurements taken in a wind tunnel. the thermal reference point s , t ref 1 and t r ef2 , used in the specifications for open frame modules are shown in figure 1 3 . for reliable operation th ese temperature s should not exceed 110 o c and 125 o c respectively. figure 13. t ref 1 & t ref2 temperature measurement location s for open frame module. the thermal reference point, t ref , used in the specifications for modules with heatplate is shown in figure 14. for reliable operation this t emperature should not exceed 110 o c. figure 14. t ref temperature measurement location for module with heatplate. heat transfer via convection increased airflow over the module enhances the heat transfer via convection. derating curves showing the maximum output current that can be delivered by each module versus local ambient temperature (t a ) for natural convection and up to 1 m/s ( 2 00 ft./min) forced airflow are shown in figure 1 5 . please refer to the application note thermal characterization process for open - frame board - mounted power modules for a detailed discussion of thermal aspects including maximum device temperatures. output current, i o (a) ambient temeperature, t a ( o c ) figure 1 5 . output current derating for the open frame module; airflow in the transverse direction from vout(+) to vout( - ); vin =48v . output current, i o (a) ambient temeperature, t a ( o c ) figure 1 6 . output current derating for the module with heatplate; airflow in the transverse direction from vout(+) to vout( - ); vin =48v. output current, i o (a) ambient temeperature, t a ( o c ) figure 1 7 . output current derating for the open frame module with heatplate and 0.25 heatsink ; airflow in the transverse direction from vout(+) to vout( - ); vin = 48 v . airflow
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 10 thermal considerations (continued) output current, i o (a) ambient temeperature, t a ( o c ) figure 1 8 . output current derating for the module with heatplate with heatplate and 0.50 heatsink ; airflow in the transverse direction from vout(+) to vout( - ); vin = 48 v . heat transfer via conduction the module can also be used in a sealed environment with cooling via conduction from the modules top surface through a gap pad material to a cold wall, as shown in figure 1 9 . this capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. the output current derating versus cold wall temperature, when using a gap pad such as bergquist gp2500s20 , is shown in figure 20 . figure 1 9 . cold wall mounting output current, i o (a) coldplate temeperature, t c ( o c) figure 20 . derated output current versus cold wall temperature with local ambient temperature around module at 85c; vin=48v.
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 11 surface mount information pick and place the modules use an open frame construction and are designed for a fully automated assembly process. the modules are fitted with a label designed to provide a large surface area for pick and place operations. the label meets all the requirements for surface mount proces sing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 o c. the label also carries product information such as product code, serial number and the location of manufacture. figure 21 . pick and place location. nozzle recommendations the module weight has been kept to a minimum by using open frame construction. even so, these modules have a relatively large mass when compared to conventional smt components. variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. the minimum recommended nozzle diameter for reliable operation is 6mm. the maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. tin lead soldering the power modules are lead free modules and can be soldered either in a lead - free solder process or in a conventional tin/lead (sn/pb) process. it is recommended t hat the customer review data sheets in order to customize the solder reflow profile for each application board assembly. the following instructions must be observed when soldering these units. failure to observe these instructions may result in the failu re of or cause damage to the modules, and can adversely affect long - term reliability. in a conventional tin/lead (sn/pb) solder process peak reflow temperatures are limited to less than 235 o c. typically, the eutectic solder melts at 183 o c, wets the land, and subsequently wicks the device connection. sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. there are several types of smt reflow technologies currently used in the industry. these surface mount power modules can be reliably soldered using natural forced convection, ir (radiant infrared), or a combination of convection/ir. for reliable soldering the solder reflow profile should be established by accurately measuring the modules cp connector temp eratures. reflow temp ( c) reflow time (s) figure 22 . reflow profile for tin/lead (sn/pb) process. max temp solder ( c) figure 2 3 . time limit curve above 205 o c for tin/lead (sn/pb) process lead free soldering the C z version of the modules are lead - free (pb - free) and rohs compliant and are both forward and backward compatible in a pb - free and a snpb soldering process . failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect l ong - term reliability. reflow soldering information the surface mountable modules in the family use our newest smt technology called column pin (cp) connectors. figure 24 shows the new cp connector before and after reflow soldering onto the end - board ass embly.
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 12 surface mount information (continued) figure 2 4 . column pin connector before and after reflow soldering . the cp is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (sn 63 /pb 37 ) solder for non - z codes, or sn/ag 3.8 /cu 0.7 (sac) solder for C z codes. the cp connector design is able to compensate for large amounts of co - planarity and still ensure a reliable smt solder joint. typically, the eutectic solder melts at 183 o c (s n/pb solder) or 217 - 218 o c (sac solder), wets the land, and subsequently wicks the device connection. sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. there are several types of smt reflow technologi es currently used in the industry. these surface mount power modules can be reliably soldered using natural forced convection, ir (radiant infrared), or a combination of convection/ir. pb - free reflow profile power systems will comply with j - std - 020 rev. c (moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices) for both pb - free solder profiles and msl classification procedures. this standard provides a recommended forced - air - convection reflow profile based on the volu me and thickness of the package (table 4 - 2). the suggested pb - free solder paste is sn/ag/cu (sac). the recommended linear reflow profile using sn/ag/cu solder is shown in figure 2 5 . figure 2 5 . recommended linear reflow profile using sn/ag/cu solder. msl rating the modules have a msl rating of 2a . storage and handling the recommended storage environment and handling procedures for moisture - sensitive surface mount packages is detailed in j - std - 033 rev. a (handling, packing, shipping and use of moisture/reflow sensitive surface mount devices). moisture barrier bags (mbb) with desiccant are required for msl ratings of 2 or greater. these sealed packages should not be broken until time of use. once the original package is broken, the floor life of the product at conditions of 30c and 60% relative humidity varies accord ing to the msl rating (see j - std - 033a). the shelf life for dry packed smt packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40 c, < 90% relative humidity. post solder cleaning and drying considera tions post solder cleaning is usually the final circuit board assembly process prior to electrical board testing. the result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit boa rd assembly. for guidance on appropriate soldering, cleaning and drying procedures, refer to lineage power board mounted power modules: soldering and cleaning application note (an04 - 001). through - hole lead - free soldering information the rohs - compliant through - hole products use the sac (sn/ag/cu) pb - free solder and rohs - compliant components. they are designed to be processed through single or dual wave soldering machines. the pins have a rohs - compliant finish that is compatible with both pb and pb - free wave soldering processes. a maximum preheat rate of 3 c/s is suggested. the wave preheat process should be such that the temperature of the power module board is kept below 210 c. for pb solder, the recommended pot temperature is 260 c, while the pb - fre e solder pot is 270 c max. not all rohs - compliant through - hole products can be processed with paste - through - hole pb or pb - free reflow process. if additional information is needed, please consult with your lineage power representative for more details. e st w board insulator solder ball end assembly pcb
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 13 emc considerations the circuit and plots in figure 2 6 show a suggested configuration to meet the conducted emission limits of en55022 class b. note: customer is ultimately responsible for the proper layout, component selection, rating and verification of the suggeted parts based on end application. lisn connected to l line lisn connected to n line figure 2 6 . emc considerations for further information on designing for emc compliance, please refer to the flt007a0 data sheet (ds05 - 028).
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 14 mechanical outline for through - hole module dimensions are in millimeters and [inches]. tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] top view* * top side label includes lineage power name, product designation and date code. side view *for optional pin lengths, see table 2, device coding scheme and options bottom view pin function 1 vi(+) 2 on/off 3 vi( - ) 4 vo( - ) 5 sense( - ) 6 trim 7 sense(+) 8 vo(+)
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 15 mechanical outline for surface mount module ( - s option) dimensions are in millimeters and [inches]. tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] * top side label includes lineage power name, product designation and date code. pin function 1 vi(+) 2 on/off 3 vi( - ) 4 vo( - ) 5 sense( - ) 6 trim 7 sense(+) 8 vo(+) vi- on/off vi+ vo- trim vo+ sense- sense+ top view side view bottom view*
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 16 mechanical outline for through - hole module with heat plate ( - h option) dimensions are in millimeters and [inches]. tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] top view side view *for optional pin lengths, see table 2, device coding scheme and options bottom view* pin function 1 vi(+) 2 on/off 3 vi( - ) 4 vo( - ) 5 sense( - ) 6 trim 7 sense(+) 8 vo(+)
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 17 recommended pad layout dimensions are in millimeters and [inches]. tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] pin function 1 vi(+) 2 on/off 3 vi( - ) 4 vo( - ) 5 sense( - ) 6 trim 7 sense(+) 8 vo(+) smt recommended pad layout (component side view) pin function 1 vi(+) 2 on/off 3 vi( - ) 4 vo( - ) 5 sense( - ) 6 trim 7 sense(+) 8 vo(+) notes: for 0.030 x 0.025 rectangular pin, use 0.050 plated through for 0.62 dia pin, use 0.076 plated through hole diameter th recommended pad layout (component side view)
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current lineage power 18 packaging details the surface mount versions of the e stw0 10 a0 a (suffix C s) are supplied as standard in the plastic trays shown in figure 2 7 . tray specification material antistatic coated pvc max surface resistivity 10 12 /sq color clear capacity 12 power modules min order quantity 48 pcs (1 box of 4 full trays + 1 empty top tray) each tray contains a total of 12 power modules. the trays are self - stacking and each shipping box for the surface mount module (suffix C s) will contain 4 full trays plus one empty hold down tray giving a total number of 48 power module s. figure 2 7 . surface mount packaging tray
data sheet november 29, 2011 estw010 a0 a series eighth - brick power modules 36 C 75vdc input; 5 .0vdc output; 10 a output current document no: ds11 - 006 ver.1.0 1 pdf name: ESTW010A0A_ ds.pdf ordering information please contact your lineage power sales representative for pricing, availability and optional features. table 1. device code s product c odes input voltage output voltage output current on/off logic connector type comcodes e stw0 10a0a 41z 48v ( 36 - 75vdc) 5 .0 v 10 a negative through hole cc109163481 estw0 10 a0 a 41 - hz 48v ( 36 - 75vdc) 5 .0v 10 a negative through hole cc109169553 estw0 10a0a 41 - sz 48v ( 36 - 75vdc) 5 .0v 10 a negative surface mount cc109168877 table 2. d evice coding scheme and options world wide headquarters lineage power corporation 601 shiloh road , plano , tx 75 074 , usa +1 - 800 - 526 - 7819 (outside u.s.a.: +1 - 972 - 2 4 4 - 9428 ) www. lineagepower .com e - mail: techsupport1@lineagepower .com asia - pacific headquarters tel: +65 6 593 7211 europe, middle - east and africa headquarters tel: +49 89 8780 67 - 2 80 india headquarters tel: +91 80 2841 1633 lineage power reserves the right to make changes to the product(s) or information contained herein without notice. no liability is assumed as a result of their use or application. no rights under any patent accompany the sale of any such product(s) or information. lineage power dc - dc products are protected under various patents . information on these patents is available at www.lineagepower.com /patents . ? 201 1 lineage power corporation , ( plano , texas) all international rights reserved.

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